Xenon Difluoride

High purity XeF2 is used in the MEMS segment of the semiconductor industry as a selective silicon etch gas. XeF2 etches silicon isotropically at high speed without the use of a plasma. The process is dry with only Xe and SiF4 being released as gaseous products. The XeF2 is free of any XeF4 contamination.
Identification of Substance
Synonyms: Xenon (II) fluoride; Xenon fluoride
Chemical Formula: XeF2
UN No: 1479
HS Code: 2812 90
CAS No: 13709-36-9
Physical & Chemical Properties
Form: Solid
Colour: White
Odour: Pungent
Density: 4.32 kg/L
Molecular Weight: 169.29
Melting Point: 129°C
Boiling Point: 114°C
Vapour Pressure: 0.5 kPa (4 Torr) at 25oC

Specifications

Purity: 99.999%
Free of any XeF4 contamination

Markets / Applications

Semiconductor: MEMS (Micro Electro Mechanical Systems)
FIB (Focussed Ion Beam)
Pharmaceutical: Organic Fluorination

Packaging Type & Sizes

PTFE bottles, customer supplied canisters or aluminium gas cylinders

Picture of packaging options




Material Safety Data Sheet (MSDS)

Xenon Difluoride - XeF2

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